Affiliation:
1. Murata Manufacturing Co., Ltd.
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Reference40 articles.
1. [1] 3GPP TS 38.101-1 V15.6.0, 3rd Generation Partnership Project; Technical Specification Group Radio Access Network; NR; User Equipment (UE) radio transmission and reception; Part 1: Range 1 Standalone, June 2019.
2. [2] F. Balteanu, H. Modi, Y. Choi, J. Lee, S. Drogi, and S. Khesbak, “5G RF front end module architectures for mobile applications,” IEEE EuMC., pp.252-255, Oct. 2019. 10.23919/eumc.2019.8910723
3. [3] K. Yamamoto, T. Moriwaki, H. Otsuka, N. Ogawa, K. Maemura, and T. Shimura, “A CDMA InGaP/GaAs-HBT MMIC power amplifier module operating with a low reference voltage of 2.4V,” IEEE J. Solid-State Circuits, vol.42, no.6, pp.1282-1290, June 2007. 10.1109/jssc.2007.897120
4. [4] D. Kang, D. Yu, K. Min, K. Han, J. Choi, D. Kim, B. Jin, M. Jun, and B. Kim, “A highly efficient and linear Class-AB/F power amplifier for multimode operation,” IEEE Trans. Microw. Theory Techn., vol.56, no.1, pp.77-87, Jan. 2008. 10.1109/tmtt.2007.911967
5. [5] G. Hau, S. Hsu, Y. Aoki, T. Wakabayashi, N. Furuhata, and Y. Mikado, “A 3x3mm2 embedded-wafer-level packaged WCDMA GaAs HBT power amplifier module with integrated Si DC power manegement IC,” IEEE RFIC, pp.409-412, April 2008. 10.1109/rfic.2008.4561465
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