Highly Integrated DBC-Based IPM with Ultra-Compact Size for Low Power Motor Drive Applications
Author:
Affiliation:
1. Shandong Normal University
2. Guangdong HIIC Semiconductor Co., LTD.
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
https://www.jstage.jst.go.jp/article/transele/E106.C/8/E106.C_2022ECS6014/_pdf
Reference21 articles.
1. [1] M. Karami, T. Li, R. Tallam, and R. Cuzner, “Thermal characterization of SiC modules for variable frequency drives,” IEEE Open J. Power El., vol.2, pp.336-345, April 2021. 10.1109/ojpel.2021.3075441
2. [2] V. Bist and B. Singh, “An adjustable-speed PFC bridgeless buck-boost converter-fed BLDC motor drive,” IEEE Trans. Ind. Electron., vol.61, no.6, pp.2665-2677, June 2014. 10.1109/tie.2013.2274424
3. [3] D. Xiang, S. Chen, H. Wang, O. Ikawa, S. Miyashita, T. Nishimura, S. Igarashi, and T. Fujihira, “1700V Si-IGBT and SiC-SBD hybrid module for AC690V inverter system,” PEAC, pp.93-97, Nov. 2014. 10.1109/peac.2014.7037835
4. [4] P.B. Bobba and K.R. Rajagopal, “Compact regenerative braking scheme for a PM BLDC motor driven electric two-wheeler,” PEDES, pp.1-5, Dec. 2010. 10.1109/pedes.2010.5712566
5. [5] G. Majumdar, M. Iwasaki, M. Fukunaga, and X. Kong, “Compact IPMs in transfer mold packages for low-power-motor drives,” Proc. ISPSD, pp.333-336, May 2004. 10.1109/wct.2004.240144
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