Noncontact PIM Measurement Method Using Partial Impedance-Matching Method
Author:
Affiliation:
1. Faculty of Engineering, Yokohama National Univ.
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
https://www.jstage.jst.go.jp/article/transele/E96.C/9/E96.C_1151/_pdf
Reference9 articles.
1. [1] D.E. Zelenchuk, A.P. Shitvov, A.G. Schuchinsky, and V.F. Fusco, “Passive intermodulation in finite lengths of printed microstrip lines,” IEEE Trans. Microw. Theory Tech., vol.56, no.11, pp.2426-2434, Nov. 2008.
2. [2] E. Rocas, C. Collado, N.D. Orloff, J. Mateu, A. Padilla, J.M. O'Callaghan, and J.C. Booth, “Passive intermoduration due to self-heating in printed transmission lines,” IEEE Trans. Microw. Theory Tech., vol.59, no.2, pp.311-322, Feb. 2011.
3. [3] H. Sato, J. Kurian, and M. Naito, “Third-order intermodulation measurements of microstrip bandpass filters based on high-temperature superconductors,” IEEE Trans. Microw. Theory Tech., vol.52, no.12, pp.2658-2663, Dec. 2004.
4. [4] RF Connectors, Connector Cable Assemblies and Cables — Intermodulation Level Measurement, IEC Standard 62037.
5. [5] Y. Yamamoto and N. Kuga, “Short circuit transmission line method for PIM evaluation of metallic materials,” IEEE Trans. Electromagn. Compat., vol.49, no.3, pp.682-688, Aug. 2007.
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