Single-Grain Si Thin-Film Transistors for Monolithic 3D-ICs and Flexible Electronics
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Published:2014
Issue:4
Volume:E97.C
Page:227-237
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ISSN:0916-8524
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Container-title:IEICE Transactions on Electronics
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language:en
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Short-container-title:IEICE Trans. Electron.
Author:
ISHIHARA Ryoichi1, ZHANG Jin1, TRIFUNOVIC Miki1, DERAKHSHANDEH Jaber1, GOLSHANI Negin1, TAJARI MOFRAD Daniel M. R.1, CHEN Tao1, BEENAKKER Kees1, SHIMODA Tatsuya23
Affiliation:
1. Faculty of Electrical Engineering, Mathematics and Computer Science, Delft University of Technology 2. School of Materials Science, Japan Advanced Institute of Science and Technology 3. Japan Science and Technology Agency ERATO, Shimoda Nano-Liquid Process Project
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Reference25 articles.
1. [1] M. Koyanagi, H. Kurino, K.W. Lee, K. Sakuma, N. Miyakawa, and H. Itani, “Future system-on-silicon LSI chips,” IEEE Micro., vol.18, no.4, pp.17-21, 1998. 2. [2] A.W. Topol, D.C. La Tulipe, Jr., L. Shi, D.J. Frank, K. Bernstein, S.E. Steen, A. Kumar, G.U. Singco, A.M. Young, K.W. Guarini, and M. Ieong, “Three-dimensional integrated circuits,” IBM Journal of Research and Development, vol.50, no.4-5, pp.491-506, 2006. 3. [3] P. Batude, M. Vinet, A. Pouydebasque, C. Le Royer, B. Previtali, C. Tabone, J.M. Hartmann, L. Sanchez, L. Baud, V. Carron, A. Toffoli, F. Allain, V. Mazzocchi, D. Lafond, S. Deleonibus, and O. Faynot, “3D monolithic integration,” 2011 IEEE International Symposium on Circuits and Systems (ISCAS), pp.2233-2236, 2011. 4. [4] M.R. Tajari Mofrad, J. Derakhshandeh, R. Ishihara, A. Baiano, J. van der Cingel, and C.I.M. Beenakker, “Monolithic stacking of single-grain thin-film transistors,” Jpn. J. Appl. Phys., vol.48, 03B015, 2009. 5. [5] Y.-H. Son, J.-W. Lee, P. Kang, M.-G. Kang, J.B. Kim, S.H. Lee, Y.-P. Kim, I.S. Jung, B.C. Lee, S.Y. Choi, U.I. Chung, J.T. Moon, and B.-I. Ryu, “Laser-induced epitaxial growth (LEG) technology for high density 3-D stacked memory with high productivity,” 2007 IEEE Symposium on VLSI Technology, pp.80-81, 2007.
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