Analysis of Antenna Performance Degradation due to Coupled Electromagnetic Interference from Nearby Circuits

Author:

LEE Hosang1,YOUSAF Jawad1,KIM Kwangho1,MUN Seongjin2,HWANG Chanseok2,NAH Wansoo1

Affiliation:

1. Department of Electrical and Computer Engineering, Sungkyunkwan University

2. Design Technology Team, Memory Division, Samsung Electronics Co. Ltd.

Publisher

Institute of Electronics, Information and Communications Engineers (IEICE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Reference13 articles.

1. [1] Z. Yu, J.A. Mix, S. Sajuyigbe, K.P. Slattery, and J. Fan, “An improved dipole-moment model based on near-field scanning for characterizing near-field coupling and far-field radiation from an IC,” IEEE Trans. Electromagn. Compat., vol.55, no.1, pp.97-108, 2013. DOI: 10.1109/TEMC.2012.2207726 10.1109/temc.2012.2207726

2. [2] H.-D. Kang, T.-H. Chung, C.-H. Jun, and J.-G. Yook, “Performance enhancement of degenerated antenna system due to external digital circuits,” IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), pp.1-4, Dec. 2010. DOI: 10.1109/EDAPS.2010.5683005 10.1109/edaps.2010.5683005

3. [3] S. Grivet-Talocia, M. Bandinu, F. Canavero, I. Kelander, and P.Kotiranta, “Fast Evaluation of Electromagnetic Interference Between Antenna and PCB Traces for Compact Mobile Devices,” 2008 IEEE International Symposium on Electromagnetic Compatibility, pp.1-5, Aug. 2008. DOI: 10.1109/ISEMC.2008.4652050 10.1109/isemc.2008.4652050

4. [4] H. Lee, J. Yousaf, J. Kim, J. Youn, D. Lee, C. Hwang, and W. Nah, “Analysis of antenna performance degradation due to VCO source using active S-parameters,” EMC Europe 2018, Netherlands,Amsterdam, Aug. 2018. DOI: 10.1109/EMCEurope.2018.8485062 10.1109/emceurope.2018.8485062

5. [5] H. Lee, K. Kim, J. Yousaf, J. Youn, D. Lee, C. Hwang, and W. Nah, “Analysis of electromagnetic field interference between an antenna and a multiple-noise source using active scattering parameters,” 2017 IEEE International Symposium on Electromagnetic Compatibility, Washington DC, USA, Aug. 2017. DOI: 10.1109/ISEMC.2017.8077947 10.1109/isemc.2017.8077947

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