High-Performance Modulation-Doped Heterostructure-Thermopiles for Uncooled Infrared Image-Sensor Application-Reference-Cited by-同舟云学术

High-Performance Modulation-Doped Heterostructure-Thermopiles for Uncooled Infrared Image-Sensor Application

Published:2012 Issue:8 Volume:E95.C Page:1354-1362
ISSN:0916-8524
Container-title:IEICE Transactions on Electronics
language:en
Short-container-title:IEICE Trans. Electron.

Author:

ABE Masayuki¹,KOGUSHI Noriaki²,ANG Kian Siong³,HOFSTETTER René³,MANOJ Kumar³,RETNAM Louis Nicholas³,WANG Hong³,NG Geok Ing³,JIN Chon⁴,PAVLIDIS Dimitris⁴

Affiliation:

1. 3D-bio Co., Ltd.

2. Takion Co., Ltd.

3. NOVITAS-Nanoelectronics Centre of Excellance, Nanyang Technological Univ.

4. Dept. of High Frequency Electronics, Technische Univ. Darmstadt

Publisher

Institute of Electronics, Information and Communications Engineers (IEICE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

https://www.jstage.jst.go.jp/article/transele/E95.C/8/E95.C_1354/_pdf

Reference16 articles.

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5. [5] M. Hirota, Y. Nakajima, Y. Hirose, M. Saito, F. Satou, and M. Uchiyama, “120×90 element thermoelectric infrared focal plane array with precisely patterned Au-black absorber,” Proc. 19th Sensor Symposium, pp.117-121, 2002.