Deformation of Crystal Morphology in Tin Plated Contact Layer Caused by Loading

Author:

TAMAI Terutaka1,SAWADA Shigeru1,HATTORI Yasuhiro2

Affiliation:

1. Mie University

2. AutoNetworks Technology, Ltd.

Publisher

Institute of Electronics, Information and Communications Engineers (IEICE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Reference12 articles.

1. [1] W.H. Abbott, J.H. Neer, and H.J. Healey, “Effects of test procedures and sequences on the performance of tin-plated connectors,” Proc. IEEE Holm Conference, pp.191-204, Pittsburgh, 1993.

2. [2] M. Antler, W.F. Graddick, and H.G. Tompkins, “Base metal contacts: An exploratory study of separable connection to tin-lead,” IEEE Trans. Parts Hybrids Packag., vol.PHP-11, no.1, pp.35-44, 1975.

3. [3] S.J. Krumbein, “Contact properties of tin plates,” Proc. IEEE Holm Conference on Electrical Contacts, pp.38-49, Chicago, Oct. 1974.

4. [4] M. Antler, “Survey of contact fretting in electrical connectors,” Proc. 17th International Conf. on Electrical Contacts, pp.3-22, Chicago, 1984.

5. [5] R.D. Malucci, “Characteristics of films developed in friction experiments on tin plated contacts,” Proc. 45th IEEE Holm Conference on Electrical Contacts, pp.175-185, Pittsburgh, 1999.

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