A 3.2mA-RX 3.5mA-TX Fully Integrated SoC for Bluetooth Low Energy System
Author:
Affiliation:
1. Toshiba Corp.
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
https://www.jstage.jst.go.jp/article/transele/E100.C/10/E100.C_833/_pdf
Reference16 articles.
1. [1] J. Prummel, M. Papamichail, J. Willms, R. Todi, W. Aartsen, W. Kruiskamp, J. Haanstra, E. Opbroek, S. Rievers, P. Seesink, J. van Gorsel, H. Woering, and C. Smit, “A 10mW Bluetooth Low-EnergyTransceiver with On-Chip Matching,” ISSCC Dig. Tech. Papers, pp.238-239, Feb. 2015.
2. [2] Y.-H. Liu, C. Bachmann, X. Wang, Y. Zhang, A. Ba, B. Busze, M. Ding, P. Harpe, G.-J. van Schaik, G. Selimis, H. Giesen, J. Gloudemans, A. Sbai, L. Huang, H. Kato, G. Dolmans, K. Philips, and H. de Groot, “A 3.7mW-RX 4.4mW-TX Fully Integrated Bluetooth Low-Energy/IEEE802.15.4/Proprietary Soc with an ADPLL-Based Fast Frequency Offset Compensation in 40nm CMOS,” ISSCC Dig. Tech. Papers, pp.236-237, Feb. 2015. 10.1109/isscc.2015.7063013
3. [3] T. Sano, M. Mizokami, H. Matsui, K. Ueda, K. Shibata, K. Toyota, T. Saitou, H. Sato, K. Yahagi, and Y. Hayashi, “A 6.3mW BLE Transceiver Embedded RX Image-Rejection Filter and TXHarmonic-Suppression Filter Reusing On-Chip Matching Network,” ISSCC Dig. Tech. Papers, pp.240-241, Feb. 2015. 10.1109/isscc.2015.7063015
4. [4] C. Bryant and H. Sjöland, “A 0.55mW SAW-Less Receiver Front-end for Bluetooth Low Energy Applications,” IEEE J. Emerging and selected topics in circuits and systems, vol.4, no.3, pp.262-272, Sept. 2014. 10.1109/jetcas.2014.2337153
5. [5] Bluetooth SIG, Specification of the Bluetooth System, V4.2, vol.6, Dec. 2014.
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