AC Power Supply Noise Simulation of CMOS Microprocessor with LSI Chip-Package-Board Integrated Model-Reference-Cited by-同舟云学术

AC Power Supply Noise Simulation of CMOS Microprocessor with LSI Chip-Package-Board Integrated Model

Published:2014 Issue:4 Volume:E97.C Page:264-271
ISSN:0916-8524
Container-title:IEICE Transactions on Electronics
language:en
Short-container-title:IEICE Trans. Electron.

Author:

YOSHIKAWA Kumpei¹,ICHIKAWA Kouji²,NAGATA Makoto¹

Affiliation:

1. Graduate School of System Informatics, Kobe University

2. DENSO CORPORATION

Publisher

Institute of Electronics, Information and Communications Engineers (IEICE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

https://www.jstage.jst.go.jp/article/transele/E97.C/4/E97.C_264/_pdf

Reference13 articles.

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3. [3] T. Steinecke, T. Gokcen, J. Kruppa, P. Ng, and N. Vialle, “Layout-based chip emission models using redhawk,” Proc. IEEE EMC Compo 2009.

4. [4] J.-L. Levant, M. Ramdani, J. Kruppa, P. Ng, and N. Vialle, “ICEM modeling of microcontroller current activity,” Microelectronics Journal, vol.35, pp.501-507, June 2004.

5. [5] J.-L. Levant, M. Ramdani, R. Perdriau, and M. Drissi, “EMC assessment at chip and PCB level: Use of the ICEM model for jitter analysis in an integrated PLL,” IEEE Trans. EMC, vol.49, pp.182-191, Feb. 2007.

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