Development and Photoluminescence Properties of Dinuclear Eu(III)-β-Diketonates with a Branched Tetraphosphine Tetraoxide Ligand for Potential Use in LEDs as Red Phosphors
Author:
Affiliation:
1. Photoluminescence Material Project, New Business Development Office, Next Business Development Div., Toshiba Corporation
2. Corporate R & D Center, Toshiba Corporation
3. Technology & Innovation, Chemicals Business, NITTO KASEI CO., LTD.
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
https://www.jstage.jst.go.jp/article/transele/E107.C/2/E107.C_2023DII0004/_pdf
Reference33 articles.
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2. [2] S.-G. Liu, W.-Y. Su, R.-K. Pan, and X.-P. Zhou, “Red Emission of Eu(III) Complex Based on 1-(7-(tert-butyl)-9-ethyl-9H-carbazol-2-yl)-4,4,4-trifluorobutane1,3-dione Excited by Blue Light,” Chin. J. Chem. Phys., vol.25, pp.697-702, 2012. DOI: 10.1088/1674-0068/25/06/697-702. 10.1088/1674-0068/25/06/697-702
3. [3] G. Santos, L.G. Paterno, F.J. Fonseca, A.M. Andrade, and L.F. Preira, “Enhancement of Light Emission from an Europium(III) Complex Based-OLED by Using Layer-by-Layer Assembled Hole-Transport Films,” ECS Trans., vol.39, no.1, pp.307-313, 2011. DOI: 10.1149/1.3615207. 10.1149/1.3615207
4. [4] Q. Xin, W.L. Li, G.B. Che, W.M. Su, X.Y. Sun, B. Chu, and B. Li, “Improved Electroluminescent Performances of Europium-Complex Based Devices by Doping into Electron-Transporting/Hole-Blocking Host,” Appl. Phys. Lett., vol.89, 223524, 2006. DOI: https://doi.org/10.1063/1.2400112. doi.org/10.1063/1.2400112
5. [5] A.M. Kaczmarek, Y.-Y. Liu, C. Wang, B. Laforce, L. Vincze, P. Van Der Voort, K. Van. Hecke, and R. Van Deun, “Lanthanide “Chameleon” Multistage Anti-Counterfeit Materials,” Adv. Funct. Mater., vol.27, 1700258, 2017. DOI: https://doi.org/10.1002/adfm.201700258 10.1002/adfm.201700258
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1. Dinuclear Eu (III)-ß-Diketonates with Tetraphosphine Tetraoxide Ligand and their LED Applications;2024 International Conference on Electronics Packaging (ICEP);2024-04-17
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