Comparative Analysis of Bandgap-Engineered Pillar Type Flash Memory with HfO2 and S3N4 as Trapping Layer

Author:

LEE Sang-Youl1,YANG Seung-Dong1,OH Jae-Sub12,YUN Ho-Jin1,JEONG Kwang-Seok1,KIM Yu-Mi1,LEE Hi-Deok1,LEE Ga-Won1

Affiliation:

1. Department of Electronics Engineering, Chungnam National University

2. Division of Nano-Process Technology, National Nano Fab Center (NNFC)

Publisher

Institute of Electronics, Information and Communications Engineers (IEICE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Reference28 articles.

1. [2] The International Technology Roadmap for Semiconductors (ITRS), pp.36-38, 2001.

2. [3] C.Y. Ng, T.P. Chen, and A. Du, “A study of influence of tunnel oxide thickness on the performance of flash memory based on ion-beam synthesized silicon nanocrystals,” Physica Status Solidi, pp.1291-1295, 2006.

3. Stress-induced leakage current of tunnel oxide derived from flash memory read-disturb characteristics

4. [6] S. Tiwari, F. Rana, H. Hanafi, A. Hartstein, E.F. Crabbe, and K. Chan, “A Silicon nanocrystals based memory,” Appl. Phys. Lett., vol.68, pp.1377-1379, 1996.

5. [7] I.H. Choi, T.S. Park, S.Y. Choi, J.D. Lee, and J.H. Lee, “Body-tied double-gate SONOS flash (omega flash) memory device built on bulk Si wafer,” Device Research Conference, pp.133-134, 2003.

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