Affiliation:
1. School of Microelectronics, Xidian University
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference33 articles.
1. [1] W. X. Fang and Q. W. Huang: “A study of the mechanical reliability of a MEMS microphone,” IPFA (2013) 716 (DOI: 10.1109/IPFA.2013.6599261).
2. [2] H. Yanazawa and K. Homma: “Growing market of MEMS and technology development in process and tools specialized to MEMS,” EDTM (2017) 143 (DOI: 10.1109/EDTM.2017.7947543).
3. [3] Y. H. Liu, et al.: “A compact single-cantilever multicontact RF-MEMS switch with enhanced reliability,” IEEE Microw. Compon. Lett. 28 (2018) 191 (DOI: 10.1109/LMWC.2018.2800523).
4. [4] S.-X. Gao, et al.: “Reliability optimization of a 3D packaged micro-machined wind sensor,” ICEPT (2018) 1032 (DOI: 10.1109/ICEPT.2018.8480678).
5. [5] G. Q. Wu, et al.: “Development of six-degree-of-freedom inertial sensors with an 8-in advanced MEMS fabrication platform,” IEEE Trans. Ind. Electron. 66 (2019) 3835 (DOI: 10.1109/TIE.2018.2851946).
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