Silicon photonics platforms for optical communication systems, outlook on future developments

Author:

Tsuda Hiroyuki1

Affiliation:

1. Dept. of Electronics and Electrical Engineering, Keio University

Publisher

Institute of Electronics, Information and Communications Engineers (IEICE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference77 articles.

1. [1] H. Takeuchi, et al.: “Monolithic integrated coherent receiver on InP substrate,” Photon. Technol. Lett. 1 (1989) 398 (DOI: 10.1109/68.43392).

2. [2] T. Tanemura, et al.: “Large-capacity compact optical buffer based on InP integrated phased-array switch and coiled fiber delay lines,” J. Lightw. Technol. 29 (2011) 396 (DOI: 10.1109/JLT.2010.2102338).

3. [3] G.E. Hoefler, et al.: “Foundry development of system-on-chip InP-based photonic integrated circuits,” J. Sel. Top. Quantum Electron. 25 (2019) 6100317 (DOI: 10.1109/JSTQE.2019.2906270).

4. [4] R. Going, et al.: “4×600 Gb/s photonic IC transmitter and receiver modules,” 2018 European Conference on Optical Communication (2018) (DOI: 10.1109/ECOC.2018.8535187).

5. [5] V. Lal, et al.: “1.6 Tbps coherent 2-channel transceiver using a monolithic Tx/Rx InP PIC and single SiGe ASIC,” Optical Fiber Communication Conference (OFC) 2020, OSA Technical Digest (2020) M3A.2 (DOI: 10.1364/OFC.2020.M3A.2).

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