Experimental study of the relationship between maximum common mode current and maximum magnetic field strength using a simple power distribution line model-Reference-Cited by-同舟云学术

Experimental study of the relationship between maximum common mode current and maximum magnetic field strength using a simple power distribution line model

Published:2019 Issue:5 Volume:8 Page:178-183
ISSN:2187-0136
Container-title:IEICE Communications Express
language:en
Short-container-title:IEICE ComEX

Author:

Okumura Hiroyuki¹,Matsushima Tohlu²,Kuwabara Nobuo²,Yamamoto Takeshi¹,Wakisaka Toshiyuki³,Fukumoto Yuki²

Affiliation:

1. Product Analysis Center, Panasonic Corporation

2. Kyushu Institute of Technology

3. Connected Solutions Company, Panasonic Corporation

Publisher

Institute of Electronics, Information and Communications Engineers (IEICE)

Subject

General Medicine

Link

https://www.jstage.jst.go.jp/article/comex/8/5/8_2019XBL0004/_pdf

Reference6 articles.

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2. [2] S. Sakuta, Y. Watanabe, M. Tokuda, and T. Higuma, “Terminal condition dependency of transmission characteristics for high-speed power line communication,” 2007 IEEE International Symposium on Electromagnetic Compatibility, Honolulu, USA, July 2007. DOI:10.1109/ISEMC.2007.131

3. [3] K. Nagamoto, N. Kuwabara, and M. Kawabata, “Calculation of emitted magnetic field using wire grid model considering dielectric material of VVF cable,” 2008 International Symposium on Electromagnetic Compatibility - EMC Europe, pp. 397–402, Hamburg, Germany, Sep. 2008. DOI:10.1109/EMCEUROPE.2008.4786867

4. [4] K. Miyoshi, N. Kuwabara, Y. Akiyama, and H. Yamane, “Calculation of radiating magnetic field from indoor AC mains cable using four-port network,” 2005 IEEE International Symposium on Electromagnetic Compatibility, Chicago, USA, pp. 1002–1007, Aug. 2005. DOI:10.1109/ISEMC.2005.1513672

5. [5] Y. Watanabe, M. Shigenaga, and M. Tokuda, “Electromagnetic field near power line for a power line communication system,” 2004 International Symposium on Electromagnetic Compatibility (EMC ’04 Sendai), 4C3-3, pp. 845–848, Sendai, Japan, June 2004.

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