A Novel Test Data Compression Scheme for SoCs Based on Block Merging and Compatibility

Author:

WU Tiebin1,LIU Hengzhu1,ZHANG Botao1

Affiliation:

1. Institute of Micro-electronics and Micro-processors, College of Computer, National University of Defense Technology

Publisher

Institute of Electronics, Information and Communications Engineers (IEICE)

Subject

Applied Mathematics,Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Signal Processing

Reference30 articles.

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2. [2] A. Steininger, “Testing and built-in self-test — A survey,” J. Systems Architecture, vol.46, pp.721-747, 2000.

3. [3] P.T. Gonciari, B. Al-Hashimi, and N. Nicolici, “Improving compression ratio, area overhead, and test application time for system-on-a-chip test data compression/decompression,” Proc. Design, Automation and Test in Europe Conference and Exhibition, pp.604-611, 2002.

4. [4] I. Bayraktaroglu and A. Orailoglu, “Decompression hardware determination for test volume and time reduction through unfied test pattern compaction and compression,” Proc. IEEE VLSI Test Symposium, pp.113-118, 2003.

5. [5] M.X. Yi, H.G. Liang, L. Zhang, and W.F. Zhan, “A novel x-ploiting strategy for improving performance of test data compression,” IEEE Trans. Very Large Scale Integr. (VLSI) Syst., vol.18, no.2, pp.324-329, 2010.

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