1. [1] Y. Zorian, E.J. Marinissen, and S. Dey, “Testing embedded-core based system chips,” Proc. International Test Conference, pp.130-143, 1998.
2. [2] A. Steininger, “Testing and built-in self-test — A survey,” J. Systems Architecture, vol.46, pp.721-747, 2000.
3. [3] P.T. Gonciari, B. Al-Hashimi, and N. Nicolici, “Improving compression ratio, area overhead, and test application time for system-on-a-chip test data compression/decompression,” Proc. Design, Automation and Test in Europe Conference and Exhibition, pp.604-611, 2002.
4. [4] I. Bayraktaroglu and A. Orailoglu, “Decompression hardware determination for test volume and time reduction through unfied test pattern compaction and compression,” Proc. IEEE VLSI Test Symposium, pp.113-118, 2003.
5. [5] M.X. Yi, H.G. Liang, L. Zhang, and W.F. Zhan, “A novel x-ploiting strategy for improving performance of test data compression,” IEEE Trans. Very Large Scale Integr. (VLSI) Syst., vol.18, no.2, pp.324-329, 2010.