Frequency signature chipless RFID tag with enhanced data capacity
Author:
Affiliation:
1. ACTSENA, Department of Telecommunication Engineering, University of Engineering and Technology
2. iPack VINN Excellence Center, Royal Institute of Technology (KTH)
3. TUCS, Department of Information Technology, University of Turku
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
https://www.jstage.jst.go.jp/article/elex/12/17/12_12.20150623/_pdf
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4. [4] Y. Feng, L. Xie, Q. Chen and L. R. Zheng: IEEE Sensors J. 15 (2015) 3201. DOI:10.1109/JSEN.2014.2385154
5. [5] E. Amin, S. Bhuiyan, N. Karmarkar and B. Jensen: IEEE Sensors J. 14 (2014) 140. DOI:10.1109/JSEN.2013.2278560
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