Development of multi-stage optical variable attenuator system and its control method for wafer inspection system
Author:
Affiliation:
1. Research & Development Group, Hitachi, Ltd.
2. Nano-Technology Solution Business Group, Hitachi High-Tech Co.
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
https://www.jstage.jst.go.jp/article/elex/20/17/20_20.20230298/_pdf
Reference31 articles.
1. [1] IRDS: “International Roadmap for Devices and Systems 2021 edition Metrology,” (2021) https://irds.ieee.org/images/files/pdf/2021/2021IRDS_MET.pdf.
2. [2] S. Matsui: Japan Patent 309713 (2007).
3. [3] L. Dou and M.P. Broderick: “A new technique for automated wafer inspection and classification of particles and crystalline defects,” IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (1997) 180 (DOI: 10.1109/ASMC.1997.630730).
4. [4] R. Schmehl, et al.: “Discrete-dipole approximation for scattering by features on surfaces by means of a two-dimensional fast Fourier transform technique,” J. Opt. Soc. Am. A 14 (1997) 3026 (DOI: 10.1364/JOSAA.14.003026).
5. [5] S. Stokowski and M. Vaez-Iravni: “Wafer inspection technology challenges for ULSI manufacturing,” AIP Conference Proceedings 449 (1998) 405 (DOI: 10.1063/1.56824).
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