A thermally optimizing method of thin film resistor trimming with machine learning
Author:
Affiliation:
1. Hirosaki University
2. Nikkohm Co., Ltd
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
https://www.jstage.jst.go.jp/article/elex/20/5/20_20.20230014/_pdf
Reference41 articles.
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2. [2] Z. Qiu, et al.: “Lifetime evaluation of inverter IGBT modules for electric vehicles mission-profile,” 2016 19th International Conference on Electrical Machines and Systems (ICEMS) (2016) 1.
3. [3] M. Guo, et al.: “Research on IGBT module failure caused by thermal stress damage,” 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) (2018) 1 (DOI: 10.1109/ICSICT.2018.8564871).
4. [4] Q. Yuan, et al.: “Failure mode verification of power IGBT under different thermal stress application conditions in power cycling test environment,” 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (2018) 367 (DOI: 10.23919/ICEP.2018.8374325).
5. [5] R.S. Chokhawala and S. Sobhani: “Switching voltage transient protection schemes for high-current IGBT modules,” IEEE Trans. Ind. Appl. 33 (1997) 1601 (DOI: 10.1109/28.649974).
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