Packet Processing Architecture with Off-Chip Last Level Cache Using Interleaved 3D-Stacked DRAM
Author:
Affiliation:
1. Network Service Systems Laboratories, NTT Corporation
2. Graduate School of Informatics, Kyoto University
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Electrical and Electronic Engineering,Computer Networks and Communications,Software
Link
https://www.jstage.jst.go.jp/article/transcom/E104.B/2/E104.B_2020EBP3017/_pdf
Reference34 articles.
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4. [4] Lagopus switch, a high performance software OpenFlow 1.3 switch. http://www.lagopus.org/
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