Manufacture and Performance of a 60GHz-Band High-Efficiency Antenna with a Thick Resin Layer and the Feed through a Hole in a Silicon Chip
Author:
Affiliation:
1. Department of Electrical and Electronic Engineering, Tokyo Institute of Technology
2. Ammsys Inc.
3. Shiima Electronics Inc.
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Electrical and Electronic Engineering,Computer Networks and Communications,Software
Link
https://www.jstage.jst.go.jp/article/transcom/E96.B/12/E96.B_3108/_pdf
Reference20 articles.
1. [1] R. Fisher, “60GHz WPAN Standardization within IEEE 802.15.3c,” Proc. Inter. Symp. on Signals, Systems and Electron., pp.103-105, 2007.
2. [2] R. Funada, H. Harada, Y. Shoji, R. Kimura, Y. Nishiguchi, M. Lei, C. Choi, F. Kojima, C. Pyo, Z. Lan, I. Lakkis, M. Umehira, and S. Kato, “A design of single carrier based PHY for IEEE 802.15.3c standard,” Inter. Symp. on Personal, Indoor and Mobile Radio Communications, pp.1-5, 2007.
3. [3] S.-S. Hsu, K.-C. Wei, C.-Y. Hsu, and H.-R. Chuang, “A 60-GHz millimeter-wave CPW-fed yagi antenna fabricated by using 0.18-µm CMOS technology,” IEEE Electron. Device Lett., vol.29, no.6, pp.625-627, June 2008.
4. [4] F. Gutierrez, S. Agarwal, K. Parrish, and T.S. Rappaport, “On-chip integrated antenna structures in CMOS for 60GHz WPAN systems,” IEEE J. Sel. Areas Commun., vol.27, no.8, pp.1367-1378, Oct. 2009.
5. [5] R. Willmot, D. Kim, and D. Peroulis, “A yagi-uda array of high-efficiency wire-bond antennas for on-chip radio applications,” IEEE Trans. Microw. Theory Tech., vol 57, no.12, pp.3315-3321, 2009.
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1. A 60GHz-Band High-Efficiency Antenna with a Thick Resin Layer and Differentially Fed through a Hole in a Silicon Chip;IEICE Transactions on Communications;2016
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