Affiliation:
1. Emperor Alexander I St. Petersburg State Transport University
Abstract
Purpose: To consider the problem of increasing the reliability of traction electric machines. To assess the effect of thermomechanical stresses on the service lifetime of insulating material of traction electric motors. Methods: Finite element method, implemented in SolidWorks 2005 software package, was chosen as the main method for studying and calculating temperature fields. Results: The results show that thermomechanical stresses play a significant role during dynamic thermal aging of stator winding insulation system. With dynamic temperature changes, an insulation system experiences repeated thermomechanical stresses since the coefficients of thermal expansion of insulating materials and copper conductors are different. Practical importance: The need for further study of the actual thermal state of electrical machines has been identified which will allow to a rise temperature definition accuracy, to give a warning for possible overheating in operation by that extending traction motor lifetime and reducing sudden failure likelihood. The developed methods for determining electrical machine thermal state are recommended for practical use.
Publisher
Petersburg State Transport University
Reference9 articles.
1. Pan, T.-Y. Thermal cycling induced plastic deformation in solder joints—Part II: Accumulated deformation in through hole joints. IEEE Trans. Compon. Hybrids Manuf. Technol. 1991, 14, 824–832., Pan, T.-Y. Thermal cycling induced plastic deformation in solder joints—Part II: Accumulated deformation in through hole joints. IEEE Trans. Compon. Hybrids Manuf. Technol. 1991, 14, 824–832.
2. Li, W.; Zhang, X. Thermal-mechanical failure and life analysis on CBGA package used for great scale FPGA chip. In Proceedings of the International Conference on Electronic Packaging Technology High Density Packaging, Beijing, China, 10–13 August 2009., Li, W.; Zhang, X. Thermal-mechanical failure and life analysis on CBGA package used for great scale FPGA chip. In Proceedings of the International Conference on Electronic Packaging Technology High Density Packaging, Beijing, China, 10–13 August 2009.
3. Yuan, Q.; Endoh, R.; Ima, T.; Kajita, Y.; Luo, Y. Failure mode verification of power IGBT under different thermal stress application conditions in power cycling test environment. In Proceedings of the International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), Mie, Japan, 17–21 April 2018; pp. 367–370., Yuan, Q.; Endoh, R.; Ima, T.; Kajita, Y.; Luo, Y. Failure mode verification of power IGBT under different thermal stress application conditions in power cycling test environment. In Proceedings of the International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), Mie, Japan, 17–21 April 2018; pp. 367–370.
4. Pedersen, K.B.; Pedersen, K. Dynamic modeling method of electro-thermo-mechanical degradation in IGBT modules. IEEE Trans. Power Electron. 2016, 31, 975–986., Pedersen, K.B.; Pedersen, K. Dynamic modeling method of electro-thermo-mechanical degradation in IGBT modules. IEEE Trans. Power Electron. 2016, 31, 975–986.
5. Грищенко А.В., Шрайбер М.А. Термомеханические напряжения в изоляции тяговых электрических машин тепловозов. В сборнике: III Бетанкуровский международный инженерный форум. Сборник трудов в двух томах. Санкт-Петербург, 2021. С. 107-109., Grischenko A.V., Shrayber M.A. Termomehanicheskie napryazheniya v izolyacii tyagovyh elektricheskih mashin teplovozov. V sbornike: III Betankurovskiy mezhdunarodnyy inzhenernyy forum. Sbornik trudov v dvuh tomah. Sankt-Peterburg, 2021. S. 107-109.