Effect of Ar Annealing on Diffusion and Thermal Stability of Transition Metal Thin-Film Systems-Reference-Cited by-同舟云学术

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Effect of Ar Annealing on Diffusion and Thermal Stability of Transition Metal Thin-Film Systems

Published:2022-09-06 Issue:6 Volume:44 Page:735-749
ISSN:1024-1809
Container-title:METALLOFIZIKA I NOVEISHIE TEKHNOLOGII
language:
Short-container-title:Metallofiz. Noveishie Tekhnol.

Author:

Orlov A. K., ,Kruhlov I. O.,Lozova A.,Sidorenko S. I.,Prikhodko S. V.,Voloshko S. M., , , , , ,

Publisher

National Academy of Sciences of Ukraine (Co. LTD Ukrinformnauka) (Publications)

Subject

Metals and Alloys,Condensed Matter Physics,General Mathematics,Electronic, Optical and Magnetic Materials

Reference32 articles.

1. Structural, electrical and magnetic properties of evaporated Ni/Cu and Ni/glass thin films

2. The Link between Ag‐Paste Rheology and Screen‐Printed Solar Cell Metallization

3. Crystalline Silicon Solar Cells with Nickel/Copper Contacts

4. Investigation of the physical properties of Fe/Si for use in a Cu/Fe/Si solar cells contact

5. Degradation of plated silicon solar module due to copper diffusion: The role of capping layer formation and contact adhesion

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The effect of the argon-containing environment on the structural phase transformations in Ni/Ti layered thin films;Metaloznavstvo ta obrobka metalìv;2023-12-11

2. Inhibition of interlayer diffusion and reduction of impurities in thin metal films by ion irradiation;Materials Today Communications;2023-03

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