High-quality, room-temperature, surface-activated bonding of GaInAsP/InP membrane structure on silicon-Reference-Cited by-同舟云学术

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High-quality, room-temperature, surface-activated bonding of GaInAsP/InP membrane structure on silicon

Published:2020-06-01 Issue:6 Volume:59 Page:060905
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:
Short-container-title:Jpn. J. Appl. Phys.

Author:

Fang Weicheng,Takahashi Naoki,Ohiso Yoshitaka,Amemiya Tomohiro,Nishiyama Nobuhiko

Funder

Core Research for Evolutional Science and Technology

Accelerated Innovation Research Initiative Turning Top Science and Ideas into High-Impact Values

Japan Society for the Promotion of Science

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Link

https://iopscience.iop.org/article/10.35848/1347-4065/ab958a/pdf

Reference21 articles.

1. Technology and reliability constrained future copper interconnects. I. Resistance modeling

2. Technology and reliability constrained future copper interconnects. II. Performance implications

3. Device Requirements for Optical Interconnects to Silicon Chips

4. III-V/silicon photonics for on-chip and intra-chip optical interconnects

5. Die-to-Die Adhesive Bonding Procedure for Evanescently-Coupled Photonic Devices

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Room-Temperature Bonding of Indium Phosphide Wafers and Their Atomic Structure at the Bond Interface;ACS Applied Electronic Materials;2023-11-08

2. High-temperature and high-efficiency operation of a membrane optical link with a buried-ridge-waveguide bonded on a Si substrate;Optics Express;2022-09-06

3. Reduced Thermal Resistance of Membrane Fabry-Perot Laser Bonded on Si Through Room-Temperature, Surface-Activated Bonding Assisted by a-Si Nano-Film;IEEE Journal of Quantum Electronics;2022-04

4. Structure and morphology of GaInAsP solid solutions on GaAs substrates grown by pulsed laser deposition;Thin Solid Films;2022-02

5. Thermal resistance reduction of membrane FP laser bonded by a-Si nano-film assisted surface activated bonding;JSAP-OSA Joint Symposia 2021 Abstracts;2021

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