Abstract
Abstract
Kinetics of SiC surface nitridation process of high-temperature N2 annealing was investigated with 4H-SiC(0001)/SiO2 structure based on the correlation between the rates of N incorporation and SiC consumption induced by SiC etching. During the early stage of the annealing process, the rate-limiting step for N incorporation would be the removal of the topmost C atoms in the slow-etching case, while it would be another reaction step, probably the activation process of nitrogen in the fast-etching case. The SiO2 layer thickness and the annealing ambient which serve as the parameters to affect the SiC etching rate, would determine the N incorporation rate according to the kinetic correlation between the N incorporation and SiC etching. The SiC consumption observed during high-temperature annealing in N2 or N2/H2 ambient would be induced by the active oxidation by residual O2 or H2O in the ambient, which would lead to the SiC surface roughening.
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Cited by
1 articles.
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