Deformation mechanism of powder-spray-coated Cu particle at room temperature-Reference-Cited by-同舟云学术

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Deformation mechanism of powder-spray-coated Cu particle at room temperature

Published:2020-08-27 Issue:9 Volume:59 Page:095504
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:
Short-container-title:Jpn. J. Appl. Phys.

Author:

Kim Ik-Soo,Jang Chan-Ik,Cho Myung-Yeon,Lee Yeon-Sook,Koo Sang-Mo,Lee Dong-Won,Oh Jong-Min

Funder

Korea Electric Power Corporation

National Research Foundation of Korea

High-Level Track of Power Semiconductor Technology for Renewable Energy and Electrical Vehicle

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Link

https://iopscience.iop.org/article/10.35848/1347-4065/abae05/pdf

Reference36 articles.

1. Silver metallization for microwave device using aerosol deposition

2. Influence of the electron mean free path on the resistivity of thin metal films

3. Copper interconnections and reliability

4. Nanoscale morphology of electrolessly deposited silver metal

5. Electroplating Copper onto Resistive Barrier Films

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Influence of the Gas Preheating Temperature on the Microstructure and Electrical Resistivity of Copper Thin Films Prepared via Vacuum Cold Spraying;Coatings;2023-10-31

2. Enhanced Electromechanical Response and Thermal Stability of 0.93(Na 1/2 Bi 1/2 )TiO 3 ‐0.07BaTiO 3 Through Aerosol Deposition of Base Metal Electrodes;Advanced Materials Interfaces;2021-05-07

3. Unique Noncontact Monitoring of Human Respiration and Sweat Evaporation Using a CsPb2Br5-Based Sensor;ACS Applied Materials & Interfaces;2021-01-26

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