A loadless 4T SRAM powered by gate leakage current with a high tolerance for fluctuations in device parameters

Abstract

Abstract A novel loadless four-transistor static random access memory cell is proposed that consists of two N-type driver MOSFETs and two P-type access ones whose gate leakage currents from word-line are used for holding data in the cell. It is shown that the proposed cell has a higher tolerance for manufacturing device fluctuations compared with the conventional loadless 4T SRAM. Furthermore, it is free from bit-line disturb in contrast to the conventional cell. It is confirmed by simulation in 32nm technology node that the read static noise margin of the proposed cell reaches 138.7% of the six-transistor SRAM cell and that the hold static noise margin can be acceptable when the gate insulator thickness of the P-type access MOSFETs is made thinner than the N-type driver MOSFETs. The retention current for the proposed cell decreases to 66.7% of the 6TSRAM and the data rate in read increases to 125%.