Development of Expanded Perlite Board for Thermal Insulation

Author:

Keawprak Nittaya, ,Arkom Pisuit,Lao-auyporn Pracha,Kaewpreak Nikorn,Wannasut Pimpilai,Watcharapasorn Anucha, , , , , ,

Abstract

In this study, the perlite-based insulating material is developed to meet ASTM C610 standards in a form of the board. Expanded perlite powders with a tapped density of 53 and 150 kg/m³ were used in this study. Sodium silicate used as a proper binder at various concentrations was mixed with perlite powders. The homogeneous moist mixture was formed by uniaxial pressing at different compaction ratios. Specimens were dried at low temperatures (250-400°C). Measurements of physical properties e.g., fl exural strength, bulk density and thermal conductivity, were conducted. Perlite foam was set after drying, leading to an increase in its moisture resistance and strength. Compression molding also affected the density and strength of the products. Heat treatment after forming was carried out in order to dehydrate water molecules and bond particles together. The specimens were tested in accordance with ASTM C610 as a result of optimum conditions from perlite powder with a tapped density of 53 kg/m3. Perlite foam board had been successfully fabricated with a bulk density of 205 kg/m3, fl exural strength of 434 kPa, compressive strength of 764 kPa and room temperature thermal conductivity of 0.056 W/m.K.

Publisher

Chiang Mai University

Subject

General Physics and Astronomy,General Biochemistry, Genetics and Molecular Biology,General Materials Science,General Mathematics,General Chemistry

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3