Board level drop test method of components for handheld electronicproduc ts
Publisher
BSI British Standards
Cited by
1 articles.
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1. Numerical Study on the Correlation between Board-level Drop and Shock Tests for Chip-Scale Packages;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07