Author:
Gupta Mudit,Kumar Ippaka Naveen,Kumar Chinige Sampath
Reference15 articles.
1. Tong, Ho-Ming, Yi-Shao Lai, and C. P. Wong, eds. Advanced flip chip packaging. Vol. 142. New York: Springer US, 2013. change material. J Therm Anal Calorim 140, 1177-1189 (2020).
2. Ying-Che Weng, Hung-Pin Cho, Chih-Chung Chang, Sih-Li Chen, Heat pipe with PCM for electronic cooling, Applied Energy, Volume 88, Issue 5,2011,Pages 1825-1833, ISSN 0306-2619
3. Ying-Che Weng, Hung-Pin Cho, Chih-Chung Chang, Sih-Li Chen, Heat pipe with PCM for electronic cooling, Applied Energy, Volume 88, Issue 5,2011,Pages 1825-1833, ISSN 0306-2619.
4. Saad Mahmoud, Aaron Tang, Chin Toh, Raya AL-Dadah, Sein Leung Soo, Experimental investigation of inserts configurations and PCM type on the thermal performance of PCM based heat sinks,Applied Energy,Volume 112, 2013, Pages 1349-1356, ISSN 0306-2619.
5. F.L. Tan, C.P. Tso, Cooling of mobile electronic devices using phase change material Appl Therm Eng, 24 (2004), pp. 159-169.