FORCED CONVECTIVE/CONDUCTIVE CONJUGATE HEAT TRANSFER IN MICROELECTRONIC EQUIPMENT
Author:
Publisher
Begell House
Subject
Mechanical Engineering,Energy Engineering and Power Technology,Condensed Matter Physics
Link
https://dl.begellhouse.com/download/article/07d5e7bf376a7d6f/HT vol VIII (1-45)s.pdf
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Research progress of air-cooled heat dissipation technology;Journal of Physics: Conference Series;2021-07-01
2. An invariant descriptor for conjugate forced convection-conduction cooling of 3D protruding heaters in channel flow;Frontiers of Mechanical Engineering;2015-09
3. Experimental Evaluation of the Conjugate Cooling of a Protruding Heater in a Duct;Heat Transfer Engineering;2015-01-06
4. An invariant descriptor for heaters temperature prediction in conjugate cooling;International Journal of Thermal Sciences;2012-08
5. Liquid Metal Based Miniaturized Chip-Cooling Device Driven by Electromagnetic Pump;Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology;2005-01-01
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