THERMO-ELECTRICAL CO-DESIGN OF THREE-DIMENSIONAL INTEGRATED CIRCUITS: CHALLENGES AND OPPORTUNITIES-Reference-Cited by-同舟云学术

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THERMO-ELECTRICAL CO-DESIGN OF THREE-DIMENSIONAL INTEGRATED CIRCUITS: CHALLENGES AND OPPORTUNITIES

Published:2013 Issue:6 Volume:5 Page:441-458
ISSN:1940-2503
Container-title:Computational Thermal Sciences
language:en
Short-container-title:Comput Thermal Scien

Author:

Bar-Cohen Avram,Srivastava Ankur,Shi Bing

Publisher

Begell House

Subject

Computational Mathematics,Fluid Flow and Transfer Processes,Surfaces and Interfaces,Energy Engineering and Power Technology

Link

https://dl.begellhouse.com/download/article/3c37f4e71dff1e12/CTS0506(1)-7643.pdf

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Overview of Current Thermal Management of Automotive Power Electronics for Traction Purposes and Future Directions;IEEE Transactions on Transportation Electrification;2022-06

2. Supervised Machine-Learning Approach for the Optimal Arrangement of Active Hotspots in 3-D Integrated Circuits;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-10

3. Electrothermal Circuit Design With Heat Flow Control—Synchronous Buck Converter Case Study;IEEE Transactions on Components, Packaging and Manufacturing Technology;2018-02

4. PCB-level Electro thermal Coupling Simulation Analysis;Journal of Physics: Conference Series;2017-10

5. Design of Anisotropic Thermal Conductivity in Multilayer Printed Circuit Boards;IEEE Transactions on Components, Packaging and Manufacturing Technology;2015-12

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