SINGLE PHASE THERMAL AND HYDRAULIC PERFORMANCE OF A HYBRID PIN FIN AND SCHOEN-G TPMS ARCHITECTURE COLD PLATE FOR ELECTRONICS THERMAL MANAGEMENT-Reference-Cited by-同舟云学术

SINGLE PHASE THERMAL AND HYDRAULIC PERFORMANCE OF A HYBRID PIN FIN AND SCHOEN-G TPMS ARCHITECTURE COLD PLATE FOR ELECTRONICS THERMAL MANAGEMENT

Published:2023 Issue: Volume: Page:
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Container-title:Proceeding of International Heat Transfer Conference 17
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Author:

Muslu Ahmet Mete,Joshi Yogendra

Publisher

Begellhouse

Reference20 articles.

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3. Muslu, A.M., Arik, M., 'Impact of Electronics Over Localized Hot Spots in Multi-Chip White LED Light Engines,' 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Las Vegas, NV, USA, pp. 31-39, (2019).

4. Ye, H., Lin, M., Basaran, C., 'Failure modes and FEM analysis of power electronic packaging, Finite Elements in Analysis and Design', Volume 38, Issue 7, Pages 601-612, (2002).

5. Jung, K.W., Hazra, S., Kwon, H., Piazza, A., Jih, E., Asheghi, M., Gupta, M.P., Degner, M., Goodson, K.E., 'Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm2) Power Electronics Cooling.', Proceedings of the ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Anaheim, California, USA. October 7-9, (2019).