THERMOPHYSICAL PROPERTIES OF CARBON-FIBER COMPOSITE MATERIALS BASED ON WOVEN SEMIPREGS USING EPOXY BINDER AS A BASE

Abstract

We report a study of thermal conductivity and specific heat of a new carbon fiber polymer composite material (PCM) made of 25 semipreg layers based on the carbon fiber thermoplastic UMT40-3K-EP and the new-generation melt epoxy binder composed of modified epoxy resin, amine aromatic hardener, and thermoplastic. The values of thermal conductivity and specific heat, as well as their temperature dependence, are within the temperature range from -20°С to 80°С. The values of thermal conductivity vary from 0.4 to 0.515 W/(m · °C) and those of specific heat: from 878 to 959 J/(kg · °C). The obtained results can find use in calculating and designing systems and devices using a PCM as a construction material, as well as in calculating parameters of the technological process of PCM production.