A TWO-SCALE APPROACH FOR THE DROP SHOCK SIMULATION OF A PRINTED CIRCUIT BOARD PACKAGE CONSIDERING REFLOWED SOLDER BALL GEOMETRIES-Reference-Cited by-同舟云学术

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A TWO-SCALE APPROACH FOR THE DROP SHOCK SIMULATION OF A PRINTED CIRCUIT BOARD PACKAGE CONSIDERING REFLOWED SOLDER BALL GEOMETRIES

Published:2020 Issue:4 Volume:18 Page:455-476
ISSN:1543-1649
Container-title:International Journal for Multiscale Computational Engineering
language:en
Short-container-title:Int J Mult Comp Eng

Author:

Hu Wei,Pan Xiaofei,Lyu Dandan,Srivastava Ashutosh,Shah Siddharth,Wu Cheng-Tang

Publisher

Begell House

Subject

Computer Networks and Communications,Computational Mechanics,Control and Systems Engineering

Link

http://www.dl.begellhouse.com/download/article/5b78291863d5f42b/JMC1804(4)-35631.pdf

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Integrated Process-Mechanical Stress Analysis of 2.5D/3D ICs with Two Types of Interconnections in Advanced Packaging;2023 IEEE International Integrated Reliability Workshop (IIRW);2023-10-08

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