DESIGN OF A COOLING SYSTEM FOR MICROCHIPS WITH HIGH HEAT-FLUX DENSITY USING INTEGRATED MICROCHANNELS-Reference-Cited by-同舟云学术

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DESIGN OF A COOLING SYSTEM FOR MICROCHIPS WITH HIGH HEAT-FLUX DENSITY USING INTEGRATED MICROCHANNELS

Published:2017 Issue:14 Volume:48 Page:1299-1312
ISSN:1064-2285
Container-title:Heat Transfer Research
language:en
Short-container-title:Heat Trans Res

Author:

Wang Shufang,Zhou Debao,Yang Zhiyong

Publisher

Begell House

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Link

https://dl.begellhouse.com/download/article/43f2991514aedc29/17180-final.pdf

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Review on Flow Boiling Patterns in Microchannels;2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2022-09-28

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