Measurement of Adhesive Force Between Mold and Photocurable Resin in Imprint Technology-Reference-Cited by-同舟云学术

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Measurement of Adhesive Force Between Mold and Photocurable Resin in Imprint Technology

Published:2002-06-30 Issue:Part 1, No. 6B Volume:41 Page:4194-4197
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Taniguchi Jun,Kawasaki Takeshi,Tokano Yuji,Kogo Yasuo,Miyamoto Iwao,Komuro Masanori,Hiroshima Hiroshi,Sakai Nobuji,Tada Kentaro

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Link

http://stacks.iop.org/1347-4065/41/i=6S/a=4194/pdf

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