Effects of Ammonia Plasma Treatment on the Electrical Properties of Plasma-Enhanced Chemical Vapor Deposition Amorphous Hydrogenated Silicon Carbide Films
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/41/i=9R/a=5734/pdf
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
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2. Effect of thermal treatment on physical, electrical properties and reliability of porogen-containing and porogen-free ultralow-k dielectrics;Thin Solid Films;2013-01
3. The effect of localized lateral growth of multiwalled carbon nanotubes with ammonia plasma post-treatment;Surface and Interface Analysis;2012-03-01
4. Comprehensive comparison of electrical and reliability characteristics of various copper barrier films;J VAC SCI TECHNOL B;2011
5. Preparation and properties of SiCN diffusion barrier layer for Cu interconnect in ULSI;Transactions of Nonferrous Metals Society of China;2009-06
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