Behavior of Dust Particles in Plasma Etching Apparatus
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Reference16 articles.
1. Investigation of particle reduction and its transport mechanism in UHF-ECR dielectric etching system
2. Behavior of Particles Reflected by Turbo Molecular Pump in Plasma Etching Apparatus
3. Capture of flaked particles during plasma etching by a negatively biased electrode
4. Trapping and behavior of particulates in a radio frequency magnetron plasma etching tool
5. Observation of the trajectories of particles in process equipment by an in situ monitoring system using a laser light scattering method
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1. Minimization of Particle Deposition on Wafers Caused by the Pressure Change in the Vacuum Chamber Through a Pressure Control Regulation Process;IEEE Transactions on Semiconductor Manufacturing;2024-08
2. Modification of discharge sequences to control the random dispersion of flake particles during wafer etching;Journal of Vacuum Science & Technology B;2023-11-14
3. Evaluation of the small particle adhesion force on low temperature surface in high vacuum using atomic force microscopy;Japanese Journal of Applied Physics;2022-07-27
4. Experimental observation and numerical investigation of imposed pattern formation in magnetized plasmas by a wide wire mesh;Plasma Sources Science and Technology;2020-08-26
5. Effect of surface roughness on small particle adhesion forces evaluated by atomic force microscopy;Japanese Journal of Applied Physics;2020-07-01
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