Thin Copper Seed Layers in Interconnect Metallization Using the Electroless Plating Process
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Ta and Ru Seed Layers Effect on the Crystallinity and Wettability of Co60Fe20V20 Films;Journal of Nanoscience and Nanotechnology;2018-10-01
2. Ta and Ru seed layers effect on the magnetic and optical properties of Ru/Co 60 Fe 20 V 20 and Ta/Co 60 Fe 20 V 20 films;Journal of Magnetism and Magnetic Materials;2018-10
3. Deposition of a Continuous and Conformal Copper Seed Layer by a Large-Area Electron Cyclotron Resonance Plasma Source with Embedded Lisitano Antenna;Plasma Chemistry and Plasma Processing;2013-11-12
4. The pH-sensitive Pd nanoparticles as ink for ink-jet printing technology and electroless Cu metallic patterns on indium-doped tin oxide substrate;Thin Solid Films;2013-06
5. Nanoindentation and Adhesion Properties of Ta Thin Films;Journal of Nanomaterials;2013
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