Author:
Wang Jenn-Shing,Lin Shih-Pin,Hon Min-Hsiung,Wang Moo-Chin
Abstract
The debinding process in the case of metal injection molding for
fabrication of the Fe–6Ni–4Cu compact and variables such as
temperature and time has been studied. The debinding process of
multiple organic binders in the Fe–6Ni–4Cu compact was investigated
by thermal gravimetric analysis (TGA) weight loss and mercury
porosimetry analysis. The weight loss of wax and SA dramatically
increases from below 10 wt% to 76.0 wt% and 86.0 wt% after
immersion in 35°C and 40°C n-hexane for 6 h,
respectively. The interdiffusion coefficients of the binder and
solvent are 9.763×10-7 cm2/s and 1.295×10-6 cm2/s, respectively. The temperature dependent
interdiffusion coefficient for the Fe–6Ni–4Cu compact can be
expressed as D
x
=4.534×10exp
(-5437.2/T). The distribution
of pore size is about 0.1–1.9 µm for the Fe–6Ni–4Cu compact.
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Cited by
5 articles.
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