Wafer-Level Packaging for Micro-Electro-Mechanical Systems Using Surface Activated Bonding
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Reference4 articles.
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4. Stress Measurements in Silicon Substrates withTiSi2Patterns Using Raman Microprobe
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3. Packaging of Biomolecular and Chemical Microsensors;Nano-Bio- Electronic, Photonic and MEMS Packaging;2021
4. Graphene transfer by surface activated bonding with poly(methyl glutarimide);Japanese Journal of Applied Physics;2017-12-05
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