Seedless Fill-Up of the Damascene Structure Only by Copper Electroless Plating-Reference-Cited by-同舟云学术

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Seedless Fill-Up of the Damascene Structure Only by Copper Electroless Plating

Published:2003-08-01 Issue:Part 2, No. 8A Volume:42 Page:L953-L955
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Kim Jae Jeong,Cha Seung Hwan,Lee Young-Soo

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Link

http://stacks.iop.org/1347-4065/42/i=8A/a=L953/pdf

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