The Effect of Backside Particles on Substrate Topography-Reference-Cited by-同舟云学术

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The Effect of Backside Particles on Substrate Topography

Published:2005-10-11 Issue:10 Volume:44 Page:7409-7413
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Bearda Twan,Mertens Paul W.,Holsteyns Frank,De Bisschop Peter,Compen René,van Meer Aschwin,Heyns Marc M.

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mitigation of EUV photoresist pattern deformation by wafer backside cleaning techniques;Advances in Patterning Materials and Processes XLI;2024-04-09

2. Pattern deformation mitigation for EUV photoresists using wafer backside cleaning techniques;Japanese Journal of Applied Physics;2024-03-01

3. Modelling of the backside pattern transfer in magic mirror (Makyoh) imaging;Journal of Optics;2022-12-22

4. The Effect of Thermal Aging on Nano-Particle Removal;Solid State Phenomena;2021-02

5. Detection and Measurement of Particulate Contaminants;Handbook of Silicon Wafer Cleaning Technology;2018

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