Defects in Electroplated Cu and Their Impact on Stress Migration Reliability Studied using Monoenergetic Positron Beams-Reference-Cited by-同舟云学术

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Defects in Electroplated Cu and Their Impact on Stress Migration Reliability Studied using Monoenergetic Positron Beams

Published:2007-04-24 Issue:4B Volume:46 Page:1938-1941
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Uedono Akira,Suzuki Takashi,Nakamura Tomoji,Ohdaira Toshiyuki,Suzuki Ryoichi

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Reference19 articles.

1. Electroless copper deposition for ULSI

2. Recrystallization kinetics of electroplated Cu in damascene trenches at room temperature

3. Effects of copper seedlayer deposition method for electroplating

4. Void formation by thermal stress concentration at twin interfaces in Cu thin films

5. In situstudy of void growth kinetics in electroplated Cu lines

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Vacancy-Type Defects and Oxygen Incorporation in NiAl for Advanced Interconnects Probed by Monoenergetic Positron Beams and Atom Probe Tomography;ACS Applied Electronic Materials;2024-07-10

2. Impact of nanosecond laser annealing on vacancies in electroplated Cu films studied by monoenergetic positron beams;Journal of Applied Physics;2023-10-03

3. Vacancy reactions near the interface between electroplated Cu and barrier metal layers studied by monoenergetic positron beams;Journal of Applied Physics;2013-08-21

4. Material characterization for advanced Si LSI process technology by means of positron annihilation;Journal of Physics: Conference Series;2013-06-10

5. Vacancy clustering and its dissociation process in electroless deposited copper films studied by monoenergetic positron beams;Journal of Applied Physics;2012-05-15

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