Lead-Free Soldering in Electronics
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CRC Press
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Electrochemical Migration: What Happens If a Drink Is Spilled on a Computer?;2024 47th International Spring Seminar on Electronics Technology (ISSE);2024-05-15
2. Thermal Stress Field of Al2O3/Al-Ni Nanofoil/Ni Solder Joints by Self-propagation Reactions;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
3. Evaluation of Dendrite Growth between Electrodes with Different Shapes and Voltage Polarity;2023 46th International Spring Seminar on Electronics Technology (ISSE);2023-05-10
4. Loads and Failure Mechanisms;Electrical Connectors;2020-12-14
5. Experimental and Theoretical Studies of Cu-Sn Intermetallic Phase Growth During High-Temperature Storage of Eutectic SnAg Interconnects;Journal of Electronic Materials;2020-09-18
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