Delay-Free Deprotection Approach to Robust Chemically Amplified Resist.-Reference-Cited by-同舟云学术

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Delay-Free Deprotection Approach to Robust Chemically Amplified Resist.

Published:1996 Issue:4 Volume:9 Page:611-618
ISSN:0914-9244
Container-title:Journal of Photopolymer Science and Technology
language:en
Short-container-title:J. Photopol. Sci. Technol.

Author:

Hattori Takashi,Imai Akira,Yamanaka Ryoko,Ueno Takumi,Shiraishi Hiroshi

Publisher

Technical Association of Photopolymers, Japan

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics

Link

http://www.jstage.jst.go.jp/article/photopolymer1988/9/4/9_4_611/_pdf

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Dissolution Promotion Effect of Addition of Low Molecular Compounds to Positive Tone Chemically Amplified Photoresist System;Journal of Photopolymer Science and Technology;2017

2. The Photopolymer Science and Technology Award;Journal of Photopolymer Science and Technology;2016

3. Lithographic Resists;Encyclopedia of Polymer Science and Technology;2012-11-16

4. Effect of Rinse Process on Removal of Crown Type Defects during Photoresist Development;Japanese Journal of Applied Physics;2011-01-20

5. Effect of Rinse Process on Removal of Crown Type Defects during Photoresist Development;Japanese Journal of Applied Physics;2011-01-01

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