A New Thermally Stable Polyimide Film for Advanced Microelectronics Packaging-Reference-Cited by-同舟云学术

A New Thermally Stable Polyimide Film for Advanced Microelectronics Packaging

Published:2008 Issue:1 Volume:21 Page:95-99
ISSN:0914-9244
Container-title:Journal of Photopolymer Science and Technology
language:en
Short-container-title:J. Photopol. Sci. Technol.

Author:

Maeda Satoshi

Publisher

Technical Association of Photopolymers, Japan

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics

Link

http://www.jstage.jst.go.jp/article/photopolymer/21/1/21_1_95/_pdf

Reference5 articles.

1. 1. Japan Jisso Technology Roadmap 2007, Japan Electronics & Information Technology Industries Association, (2007) p147.

2. 2. For example, Y.Tukada, Intoroduction to Build-up Print Wiring Board, Nikkan Kogyo Shimbun, Ltd.,(1998) pp26-30.

3. 3. The Current and Future Prospect in Embedded Passive and Active Device Substrate, Journal of Japan Institute of Electronics Packaging, vol.11, No.1 (2008) p14.

4. 4. http://www2.dupont.com/Kapton/en_US/ index. Html.

5. 5. http://www.ube-ind.co.jp/japanese/products/fine/ fine_01_01.htm

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