Enameled Wire Having Polyimide-silica Hybrid Insulation Layer Prepared by Sol-gel Process
Author:
Affiliation:
1. Department of Biomolecular Functional Engineering, Ibaraki University
2. Power System Laboratory, Hitachi Cable, Ltd.
Publisher
Technical Association of Photopolymers, Japan
Subject
Materials Chemistry,Organic Chemistry,Polymers and Plastics
Link
https://www.jstage.jst.go.jp/article/photopolymer/28/2/28_151/_pdf
Reference5 articles.
1. 1. Y. Kim, S. Y. Park, S. Y. Kwon, S. J. Kim, J. Kim, and Y. S. Seo, Thermochimica Acta, 542, (2012) 62-68.
2. 2. A. Morikawa, K. Suzuki, and K. Asano, JP-A-Hei-10-289622 (1998).
3. 3. L. L. Hench and J. K. West, Chem. Rev., 90. (1990) 33.
4. 4. A. Morikawa, Y. Iyoku, M. Kakimoto, and Y. Imai, Polym. J. , 24 (1992) 107-113.
5. 5. A. Morikawa, H. Yamagichi, M. Kakimoto, and Y. Imai, Chem. Mater., 6 (1994) 913-917.
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