Cover-layering a Porous Polyimide Flexible Print Circuit with a Porous Polyimide Layer-Reference-Cited by-同舟云学术

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Cover-layering a Porous Polyimide Flexible Print Circuit with a Porous Polyimide Layer

Published:2016 Issue:3 Volume:29 Page:459-464
ISSN:0914-9244
Container-title:Journal of Photopolymer Science and Technology
language:en
Short-container-title:J. Photopol. Sci. Technol.

Author:

Taki Kentaro¹,Mizoguchi Akira²,Ito Hiroshi³

Affiliation:

1. Kanazawa University

2. Sumitomo Electric Industries

3. Yamagata University

Publisher

Technical Association of Photopolymers, Japan

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics

Link

https://www.jstage.jst.go.jp/article/photopolymer/29/3/29_459/_pdf

Reference14 articles.

1. 1. M. H. Weng, H. W. Wu, Y. K. Su, R. Y. Yang, C. Y. Hung, Microwave Opt. Technol. Lett., 48 (2006) 1675.

2. 2. H. W. Wu, Y. K. Su, R. Y. Yang, M. H. Weng, Y. D. Lin, Microelectron. J., 38 (2007) 304.

3. 3. B. Krause, K. Diekmann, N. F. A. van der Vegt, M. Wessling, Macromolecules, 35 (2002) 1738.

4. 4. B. Krause, G. H. Koops, N. F. A. van der Vegt, M. Wessling, M. Wubbenhorst, J. van Turnhout, Adv. Mater., 14 (2002) 1041.

5. 5. A. Mochizuki, T. Fukuoka, M. Kanada, N. Kinjou, T. Yamamoto, J. Photopolym. Sci. Technol., 15 (2002) 159.

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A strategy for the preparation of low dielectric FGQD/PSPI composite films in wafer-level packaging;Materials Today Communications;2024-08

2. Production of Ultra Low Relative Dielectric Porous Polyimide Film and Its Application to Flexible Print Cable;Seikei-Kakou;2019-11-20

3. Lateral Patterning of Porous Polyimide Film by Exposure to High-Pressure CO2 and UV Light with Photomask;Journal of Photopolymer Science and Technology;2018-06-25

4. Controlling the Pore Structure of Polyimide Films Prepared by Exposure to High-Pressure CO₂ and UV Light;Journal of Photopolymer Science and Technology;2017

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