Compatibility of the Low‐Dielectric‐Constant Poly(arylether) with the Electroless Copper Deposition Solution-Reference-Cited by-同舟云学术

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Compatibility of the Low‐Dielectric‐Constant Poly(arylether) with the Electroless Copper Deposition Solution

Published:1999-12-01 Issue:12 Volume:146 Page:4565-4568
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:
Short-container-title:J. Electrochem. Soc.

Author:

Hsu D. T.¹²,Iskandar M.¹,Shi F. G.¹,Lopatin S.³,Shacham‐Diamand Y.³,Tong H. Y.²,Zhao B.²,Brongo M.²,Vasudev P. K.⁴

Affiliation:

1. Department of Chemical Engineering and Biochemical Engineering and Materials Science, University of California, Irvine, California 92697-2575, United States of America

2. Conexant Systems, Newport Beach, California 92660, United States of America

3. School of Electrical Engineering and Cornell Nanofabrication Facility, Cornell University, Ithacha, New York 14853-5401, United States of America

4. SEMATECH, Austin, Texas 78741, United States of America

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/1.1392675/pdf

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Influence of Chemical Pretreatment of Epoxy Polymers on the Adhesion Strength of Electrochemically Deposited Cu for Use in Electronic Interconnections;Journal of The Electrochemical Society;2004

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